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AIB-MX21
Módulo NVIDIA® AGX Orin™ 64GB
- Compatível com o módulo NVIDIA Jetson AGX Orin™ de 64GB
- Até 275 TOPS de desempenho
- Ampla gama de tensão de entrada de 9 a 36 VCC
- 1x M.2 B-Key/ 1x E-Key/ 1x slot M-Key
- 1x LAN GbE/ 1x 10 GbE/ 2x IEEE 802.3af GbE PSE
- Temperatura de funcionamento: -25°C ~ +80°C
● 8 x AI performance enables AI inference with low latency
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA® Jetson AGX Xavier™ 32GB module. Built in up to 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin module enables server-class AI inference at the edge with low latency.
● Comprehensive M.2 expansion and LAN ports
AIB-MX11/12/21/22 is a platform with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. For network, on-board 2 or 4x PSE ports support 2 or 4x POE cameras, and 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.
● Wide input power and operating temperature for various embedded applications
To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIB-MX11/12/21/22 supports operating temperature ranging from -25°C to 80°C and wide input power from 9 to 36VDC.
Specifications
Model Number | AIB-MX11 | AIB-MX12 | AIB-MX21 | AIB-MX22 |
Module Compatibility | NVIDIA Jetson AGX Orin 32GB | NVIDIA Jetson AGX Orin 64GB | ||
AI Performance | 200 TOPS | 275 TOPS | ||
GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores | ||
CPU | 8-core Arm® Cortex® -A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | 12-core Arm® Cortex® -A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 | ||
Memory | 32GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s | ||
Storage | 64GB eMMC 5.1 | |||
Display | 1 x HDMI 2.0 Type A | |||
TPM | TPM v2.0 (optional) | |||
RTC | With super capacitor, battery (optional) | |||
Audio | Line-out/Line-in/Mic (optional with daughter board) | |||
Camera Input | 1 x 16-Lane MIPI Expansion Connector (120-Pin) | |||
LAN | 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port | |||
PoE Interface | 2 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* |
4 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* |
2 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* |
4 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* |
*PSE Port 1 & Port 2 support IEEE 802.3at compliant; Total PSE ports support up to 60W | ||||
USB | 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C | |||
I/O Interfaces | 2 x UART, 1 x UART (Debug only), 1 x RS-232, 1 x RS-422/485 (2-in1), 2 x CAN 2.0b (isolation; support CAN FD), 2 x I2C, 1 x I2S, 1 x SPI, 5 x GPIO, 2 x 3.3VDC/0.5A, 3 x 5VDC/0.5A, 1 x 12VDC/0.5A, 1 x USB 2.0, 1 x microSIM Card Slot |
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Expansion | 1 x M.2 B-Key 3042/3052 (LTE/4G/5G) 1 x M.2 E-Key 2230 (WiFi/BT) 1 x M.2 M-Key 2280 (supports NVMe; PCIe x2 Gen3), 1 x microSD Card Slot |
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MISC. Function | 1 x Power / Recovery / Reset button | |||
Power Consumption | Idle: 10.5 W Full Loading: 111* W |
Idle: 12 W Full Loading: 132* W |
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*For more test condition information, please refer to user manual | ||||
Power Input/Connector | DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector | |||
Dimension (WxDxH) | 176 x 132 x 57.32 mm (6.93 x 5.19 x 2.26 in) | |||
Net Weight | 0.980 kg (2.161 lb) w/ Fansink | |||
Vibration | 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis | |||
Shock | 10 G, IEC 60068-2-27, half sine, 11 ms duration | |||
Temperature | Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F) Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F) |
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Humidity | 95% @ 40°C (104°F) (non-condensing) | |||
Software Support | Linux (Support Jetpack 5.0 above) | |||
Certification | CE / FCC Class A / UKCA |
Entrega Normal | 5 a 7 dias úteis
Entrega Urgente | 3 a 5 dias úteis
*salvo rutura de stock
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Em caso de dúvidas ou preocupações, entre em contacto connosco para garantir o tempo de entrega.
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