• NVIDIA Jetson AGX Orin™ 64GB
  • 275 TOPS AI performance
  • 1x M.2 B/E/M-Key, 5* GPIO
  • 1xGbE/ 1x 10GbE/ 4x PoE GbE
  • DC-in 9 - 36VDC
com IVA
4,906.32€

sem IVA
3,988.88€
Sku: AIE-PX22-1-A1
Tipo de Produto: AI Edge box PC
Fabricante: Aetina

AIE-PX22

EDGE AI PC NVIDIA® Jetson AGX Orin™ 64GB, 4* PoE, 5* GPIO

  • Suporta o módulo NVIDIA Jetson AGX Orin™ de 64 GB
  • Até 275 TOPS de desempenho AI
  • Ampla tensão de entrada: 9 a 36 VCC
  • 1 x M.2 B-Key/ E-Key/ M-Key
  • 1 x LAN GbE, 1 x LAN 10GbE, 4x PoE
  • Temperatura de funcionamento -25°C ~ +55°C
  • Design Fanless
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Visão Geral

● 8 x AI performance enables AI inference with low latency

The NVIDIA Jetson AGX Orin modules offer up to 275 TOPS, 8 times more than NVIDIA Jetson AGX Xavier™ 32GB module. Built in 2048 NVIDIA CUDA cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin 64GB module enables server-class AI inference at the edge with low latency.


● Comprehensive M.2 expansion, PSE and LAN ports

AIE-PX22 are fanless systems with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. For network, on-board 2 or 4x PSE ports support 2 or 4x POE cameras, and 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.


● Wide input power and fanless design for smart city and smart agriculture

To cater to diverse applications, such as smart city and smart agriculture, where cost-effective maintenance and improved reliability are crucial, AIE-PX22 have been specifically designed with a fanless and silent mechanism. These systems are capable of operating within a wide temperature range of -25°C to 55°C. Additionally, they support a wide input power range from 9 to 36 VDC, enabling flexible power supply options.

Especificações

Specifications

Model Number AIE-PX11 AIE-PX12
Module Compatibility NVIDIA Jetson AGX Orin 32GB
AI Performance 200 TOPS
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores
CPU 8-core Arm® Cortex® -A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
Memory 32GB 256-bit LPDDR5 204.8 GB/s
Storage 64GB eMMC 5.1
Display 1 x HDMI 2.0 Type A
TPM TPM v2.0 (optional)
LAN 1 x RJ-45 GbE, 1 x RJ-45 10GbE
PoE Interface 2 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
4 x RJ-45 GbE PSE
(IEEE 802.3af compliant, Power Output 15W/Port)*
  *PSE Port 1 & Port 2 support IEEE 802.3at compliant; Total PSE ports support up to 60W
USB 2 x USB 3.2 Gen1 Ty pe A, 1 x USB 2.0 (DB-15), 1 x OTG Ty pe-C, 1 x USB 3.2 Gen2 Ty pe-C/td>
I/O Interfaces 2 x I2C,
1 x SPI,
5 x GPIO,
2 x UART,
1 x RS-232,
1 x RS-422/485 (2-in-1),
2 x CAN 2.0b (isolation; support CAN FD),
1 x microSIM Card Slot,
1 x OOB (optional)
Expansion 1 x M.2 B-Key 3042/3052 (LTE/4G/5G)
1 x M.2 E-Key 2230 (WiFi/BT)
1 x M.2 M-Key 2280 (supports NVMe; PCIe x2 Gen3)
1 x microSD Card Slot
MISC. Function 1 x Power / 1 x Recovery / 1 x Reset Button
Power Input/Connector DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector
Power Consumption Idle: 7.5 W
Full Loading: 109* W
  *For more test condition information, please refer to user manual
Dimension (WxDxH) 270 x 195 x 80 mm (10.63 x 7.67 x 3.15 in)
Mounting Wall Mount (optional) / Din Rail (optional)
Net Weight 4.3 kg (9.48 lb)
Vibration 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis
Shock 10 G, IEC 60068-2-27, half sine, 11 ms duration
Temperature Operating Temperature: -25°C ~ +55°C (-13°F ~ +131°F) with 0.5 m/s airflow
Storage Temperature: -40°C ~ +85°C (-40°F ~ +185°F) 
Humidity 95% @ 40°C (104°F) (non-condensing)
Software Support Linux (Support Jetpack 5.0 above)
Certification CE / FCC Class A / UKCA

*Product specifications are subject to change without prior notice

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