Não têm produtos no Carrinho.
sem IVA
- Intel® 8th-Gen Core™ i hexa-core 35W/ 65W LGA1151 CPU
- Low-profile chassis with hot-swappable 2.5" HDD/ SSD tray
- MezIO™ interface for easy function expansion
- Rugged, -25°C to 70°C fanless operation
- Up to 6x GigE ports, supporting 9.5 KB jumbo frame
- M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane™ memory
- 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
- VGA/DVI/DP triple independent display, supporting 4K2K resolution
Introducing Neousys Technology's 2018 flagship rugged fanless embedded computers, the new Nuvo-7000LP series, powered by Intel® 8th-Gen Core™ i processors with up to 6-core/ 12-thread architecture that offer a significant performance improvement over previous 6th or 7th-Gen platforms.
Nuvo-7000LP series is a derivative of Nuvo-7000 series that features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, proprietary MezIO™ interface and plethora of on-board I/O interfaces, Nuvo-7000LP series features one front-accessible, hot-swappable HDD/ SSD tray which can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB/s disk read/ write speed, or install an Intel® Optane™ memory for the ultimate system acceleration.
Neousys Nuvo-7000LP series consolidates the latest Intel hexa-core CPU, high-speed I/O interfaces, super-fast disk access and flexible storage configuration to form a high-performance ruggedized embedded computer. In addition, you can also take advantage of the built-in MezIO™ interface to add on modules for application-specific I/Os.
Product Highlights
8th-Gen Core i CPU
Powered by Intel® Coffee lake Core™ processor running with advanced Intel® Q370 chipset, The Nuvo-7000 series fanless embedded computer provides outstanding performance for emerging high-end requirement than 6th & 7th generations.
Wide Temperature
The Nuvo-7000 series fanless embedded computer has patented passive cooling thermal design that can effectively channel heat from heat sink and truly operate in wide temperature range from -25℃ to 70℃ while under 100% CPU loading.
Specification
System Core | |
---|---|
Processor | Supporting Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP) - Intel® Core™ i7-8700/ i7-8700T - Intel® Core™ i5-8500/ i5-8500T - Intel® Core™ i3-8100/ i3-8100T - Intel® Pentium® G5400/ G5400T - Intel® Celeron® G4900/ G4900T |
Chipset | Intel® Q370 Platform Controller Hub |
Graphics | Integrated Intel® UHD Graphics 630 |
Memory | Up to 32 GB DDR4 2666/2400 SDRAM (two SODIMM slots) |
AMT | Supports AMT 12.0 |
TPM | Supports TPM 2.0 |
I/O Interface | |
---|---|
Ethernet Port | 2x Gigabit Ethernet ports by I219 and I210 (Nuvo-7002LP) 6x Gigabit Ethernet ports by I219 and 5x I210 (Nuvo-7006LP) |
POE+ | Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget |
USB | 4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
Video Port | 1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution |
Serial Port | 2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
Audio | 1x 3.5 mm jack for mic-in and speaker-out |
Internal Expansion Bus | |
---|---|
Mini PCI-E | 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA) |
M.2 | 1x M.2 2242 B key socket with dual front-accessible SIM sockets |
Expandable I/O | 1x MezIO™ expansion port for Neousys MezIO™ modules |
Storage interface | |
---|---|
SATA HDD | 1x front-accessible, hot-swappable 2.5" HDD/SSD tray 1x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1 |
M.2 | 1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation |
mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
Power Supply | |
---|---|
DC Input | 1x 3-pin pluggable terminal block for 8~35VDC DC input |
Remote Ctrl. & Status Output | 1x 3-pin pluggable terminal block for remote control and PWR LED output |
Mechanical | |
---|---|
Dimension | 240 mm (W) x 225 mm (D) x 79 mm (H) |
Weight | 3.1 kg |
Mounting | Wall-mounting (standard) or DIN-Rail mounting (optional) |
Environmental | |
---|---|
Operating temperature |
with 35W CPU -25°C ~ 70°C ** with 65W CPU -25°C ~ 70°C */** (configured as 35W TDP) -25°C ~ 50°C */** (configured as 65W TDP) |
Storage temperature | -40°C ~ 85°C |
Humidity | 10% ~ 90% , non-condensing |
Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
Nuvo-7002LP
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 2x GbE ports, MezIO™ interface and low-profile chassis
Nuvo-7006LP
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 6x GbE ports, MezIO™ interface and low-profile chassis
Supported MezIO™ Modules
Neousys MezIO™ module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.
Entrega Normal | 5 a 7 dias úteis
Entrega Urgente | 3 a 5 dias úteis
*salvo rutura de stock
Trabalhamos intensamente cumprir os prazos de entrega anunciados. No entanto, enfrentamos uma escassez global relativamente a alguns componentes e fabricantes.
Em caso de dúvidas ou preocupações, entre em contacto connosco para garantir o tempo de entrega.
Poderemos aconselhar sobre a disponibilidade de hardware alternativo e fornecer recomendações de componentes disponíveis para opções de envio mais rápidas.