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- Intel® 8th-Gen Core™ i hexa-core 35W/ 65W LGA1151 CPU
- Low-profile chassis with hot-swappable 2.5" HDD/ SSD tray
- MezIO™ interface for easy function expansion
- Rugged, -25°C to 70°C fanless operation
- Up to 6x GigE ports, supporting 9.5 KB jumbo frame
- M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane™ memory
- 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
- VGA/DVI/DP triple independent display, supporting 4K2K resolution
Introducing Neousys Technology's 2018 flagship rugged fanless embedded computers, the new Nuvo-7000LP series, powered by Intel® 8th-Gen Core™ i processors with up to 6-core/ 12-thread architecture that offer a significant performance improvement over previous 6th or 7th-Gen platforms.
Nuvo-7000LP series is a derivative of Nuvo-7000 series that features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, proprietary MezIO™ interface and plethora of on-board I/O interfaces, Nuvo-7000LP series features one front-accessible, hot-swappable HDD/ SSD tray which can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB/s disk read/ write speed, or install an Intel® Optane™ memory for the ultimate system acceleration.
Neousys Nuvo-7000LP series consolidates the latest Intel hexa-core CPU, high-speed I/O interfaces, super-fast disk access and flexible storage configuration to form a high-performance ruggedized embedded computer. In addition, you can also take advantage of the built-in MezIO™ interface to add on modules for application-specific I/Os.
8th-Gen Core i CPU
Powered by Intel® Coffee lake Core™ processor running with advanced Intel® Q370 chipset, The Nuvo-7000 series fanless embedded computer provides outstanding performance for emerging high-end requirement than 6th & 7th generations.
The Nuvo-7000 series fanless embedded computer has patented passive cooling thermal design that can effectively channel heat from heat sink and truly operate in wide temperature range from -25℃ to 70℃ while under 100% CPU loading.
|Processor||Supporting Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP)
- Intel® Core™ i7-8700/ i7-8700T
- Intel® Core™ i5-8500/ i5-8500T
- Intel® Core™ i3-8100/ i3-8100T
- Intel® Pentium® G5400/ G5400T
- Intel® Celeron® G4900/ G4900T
|Chipset||Intel® Q370 Platform Controller Hub|
|Graphics||Integrated Intel® UHD Graphics 630|
|Memory||Up to 32 GB DDR4 2666/2400 SDRAM (two SODIMM slots)|
|AMT||Supports AMT 12.0|
|TPM||Supports TPM 2.0|
|Ethernet Port||2x Gigabit Ethernet ports by I219 and I210 (Nuvo-7002LP)
6x Gigabit Ethernet ports by I219 and 5x I210 (Nuvo-7006LP)
|POE+||Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget|
|USB||4x USB 3.1 Gen2 (10 Gbps) ports
4x USB 3.1 Gen1 (5 Gbps) ports
|Video Port||1x VGA connector, supporting 1920 x 1200 resolution
1x DVI-D connector, supporting 1920 x 1200 resolution
1x DisplayPort connector, supporting 4096 x 2304 resolution
|Serial Port||2x software-programmable RS-232/422/485 ports (COM1/ COM2)
2x RS-232 ports (COM3/ COM4)
|Audio||1x 3.5 mm jack for mic-in and speaker-out|
|Internal Expansion Bus|
|Mini PCI-E||1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)|
|M.2||1x M.2 2242 B key socket with dual front-accessible SIM sockets|
|Expandable I/O||1x MezIO™ expansion port for Neousys MezIO™ modules|
|SATA HDD||1x front-accessible, hot-swappable 2.5" HDD/SSD tray
1x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1
|M.2||1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation|
|mSATA||1x full-size mSATA port (mux with mini-PCIe)|
|DC Input||1x 3-pin pluggable terminal block for 8~35VDC DC input|
|Remote Ctrl. & Status Output||1x 3-pin pluggable terminal block for remote control and PWR LED output|
|Dimension||240 mm (W) x 225 mm (D) x 79 mm (H)|
|Mounting||Wall-mounting (standard) or DIN-Rail mounting (optional)|
with 35W CPU
-25°C ~ 70°C **
with 65W CPU
-25°C ~ 70°C */** (configured as 35W TDP)
-25°C ~ 50°C */** (configured as 65W TDP)
|Storage temperature||-40°C ~ 85°C|
|Humidity||10% ~ 90% , non-condensing|
|Vibration||Operating, MIL-STD-810G, Method 514.6, Category 4|
|Shock||Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II|
|EMC||CE/FCC Class A, according to EN 55032 & EN 55024|
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 2x GbE ports, MezIO™ interface and low-profile chassis
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 6x GbE ports, MezIO™ interface and low-profile chassis
Supported MezIO™ Modules
Neousys MezIO™ module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.
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