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3,245.82€
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2,638.88€
Sku: AIB-MX23-1-A1
Product Type:
NVIDIA Development Kit
Vendor:
Aetina
AIB-MX23
Módulo NVIDIA® AGX Orin™ 64GB
- Compatível com o módulo NVIDIA Jetson AGX Orin™ de 642 GB
- Até 275 TOPS de desempenho
- Ampla gama de tensão de entrada de 9 a 36 VCC
- 1x M.2 B-Key/1x E-Key/1x slot M-Key
- 1x LAN GbE/1x 10 GbE
- Temperatura de funcionamento: -25°C ~ +80°C
Visão Geral
Especificações
Downloads
Visão Geral
● 8 x AI performance enables AI inference with low latency
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA Jetson AGX Xavier™ 32GB module. Built in 2048 NVIDIA CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin module enables server-class AI inference at the edge with low latency.
● Comprehensive M.2 expansion and 1x10GbE LAN port
AIB-MX13/23 is a platform with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 M-Key for storage, and 1x M.2 E-Key for Wifi/Bluetooth/GPS. For network, on-board 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.
● Wide input power and operating temperature for various embedded applications
To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIB-MX13/23 supports temperature ranging from -25°C to 80°C and wide input power from 9 to 36VDC.
Especificações
Specifications
| Model Number | AIB-MX13 | AIB-MX23 |
| Module Compatibility | NVIDIA Jetson AGX ORIN 32GB | NVIDIA Jetson AGX ORIN 64GB |
| AI Performance | 200 TOPS | 275 TOPS |
| GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
| CPU | 8-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 2MB L2 + 4MB L3 | 12-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Memory | 32 GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Display | 1 x HDMI 2.0 Type A | |
| TPM | TPM v2.0 (optional) | |
| RTC | With super capacitor, battery (optional) | |
| Audio | Line-out/Line-in/Mic (optional with daughter board) | |
| Camera Input | 1x 16-Lane MIPI Expansion Connector | |
| LAN | 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port | |
| USB | 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C | |
| I/O Interfaces | 2 x I2C, 1 x I2S, 1 x SPI, 5 x GPIO, 1 x 3.3VDC/0.5A, 2 x 5VDC/0.5A, 1 x 12VDC/0.5A, 1 x USB 2.0, 2 x UART, 1 x UART (Debug only), 1 x RS-232, 1 x RS-422/485 (2-in-1), 2 x CAN 2.0b (isolation; support CAN FD) |
|
| Expansion | 1 x M.2 B-Key 3042/3052 (LTE/4G/5G) 1 x M.2 E-Key 2230 (WiFi/BT) 1 x M.2 M-Key 2280 (supports NVMe; PCIe x4 Gen4) 1 x microSD Card Slot |
|
| MISC. Function | 1 x Power / 1 x Recov ery / 1 x Reset button | |
| Power Consumption | Idle: 6.655 W Full Loading: 52.25* W |
Idle: 6.9 W Full Loading: 72.25* W |
| *For more test condition information, please refer to user manual | ||
| Power Input/Connector | DC-in 9 to 36 VDC / 4-pin DC Jack Power Connector | |
| Dimension (WxDxH) | 131 x 120 x 62.9 mm (5.16 x 4.72 x 2.47 in) | |
| Net Weight | 0.701 kg (1.54 lb) w/ Fansink | |
| Vibration | 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis | |
| Shock | 10 G, IEC 60068-2-27, half sine, 11 ms duration | |
| Temperature | Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F) Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F) |
|
| Humidity | 95% @ 40°C (104°F) (non-condensing) | |
| Software Support | Linux (Support Jetpack 5.0 above) | |
| Certification | CE / FCC Class A / UKCA | |
Downloads
Entrega Normal | 5 a 7 dias úteis
Entrega Urgente | 3 a 5 dias úteis
*salvo rutura de stock
Trabalhamos intensamente cumprir os prazos de entrega anunciados. No entanto, enfrentamos uma escassez global relativamente a alguns componentes e fabricantes.
Em caso de dúvidas ou preocupações, entre em contacto connosco para garantir o tempo de entrega.
Poderemos aconselhar sobre a disponibilidade de hardware alternativo e fornecer recomendações de componentes disponíveis para opções de envio mais rápidas.
