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4,917.54€
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3,998.00€
Sku: AIE-PX23-1-A1
Product Type:
AI Edge box PC
Vendor:
Aetina
AIE-PX23
EDGE AI PC NVIDIA® Jetson AGX Orin™ 64GB, 5* GPIO
- Suporta o módulo NVIDIA Jetson AGX Orin™ de 64 GB
- Até 275 TOPS de desempenho AI
- Ampla tensão de entrada: 9 a 36 VCC
- 1 x M.2 B-Key/ E-Key/ M-Key
- 1 x LAN GbE, 1 x LAN 10GbE, 5 x GPIO
- Temperatura de funcionamento -25°C ~ +70°C
- Fanless
Visão Geral
Especificações
Downloads
Visão Geral
● 8 x AI performance enables AI inference with low latency
The NVIDIA Jetson AGX Orin modules offer up to 275 TOPS, 8 times more than NVIDIA Jetson AGX Xavier™ 32GB module. Built in 2048 NVIDIA CUDA cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin 64GB module enables server-class AI inference at the edge with low latency.
● Comprehensive M.2 expansion and 1x10GbE LAN port
AIE-PX23 are fanless systems with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 M-Key for storage and 1x M.2 E-Key for Wifi/Bluetooth/GPS. For network, on-board 1x10GbE port offers data speeds up to 10 billion bits per second, 10 times faster than traditional GbE standard.
● Wide input power and fanless design for smart city and smart agriculture
To cater to diverse applications, such as smart city and smart agriculture, where cost-effective maintenance and improved reliability are crucial, AIE-PX23 have been specifically designed with a fanless and silent mechanism. These systems are capable of operating within a wide temperature range of -25°C to 55°C. Additionally, they support a wide input power range from 9 to 36 VDC, enabling flexible power supply options.
Especificações
Specifications
| Model Number | AIE-PX13 | AIE-PX23 |
| Module Compatibility | NVIDIA Jetson AGX Orin 32GB | NVIDIA Jetson AGX Orin 64GB |
| AI Performance | 200 TOPS | 275 TOPS |
| GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores |
| CPU | 8-core NVIDIA Arm® Cortex® -A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
12-core NVIDIA Arm® Cortex® -A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Memory | 32GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 | |
| Display | 1 x HDMI 2.0 Type A | |
| Audio | Line-out/Line-in/Mic (optional with daughter board) | |
| LAN | 1 x RJ-45 GbE, 1 x RJ-45 10GbE | |
| USB | 2 x USB 3.2 Gen1 Type A, 1 x USB 2.0 (DB-15), 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C | |
| I/O Interfaces | 2 x I2C, 1 x SPI, 5 x GPIO, 2 x UART, 1 x RS-232, 1 x RS-422/485 (2-in-1), 2 x CAN 2.0b (isolation; support CAN FD), 1 x microSIM Card Slot |
|
| Expansion | 1 x M.2 B-Key 3042/3052 (LTE/4G/5G) 1 x M.2 E-Key 2230 (WiFi/BT) 1 x M.2 M-Key 2280 (supports NVMe; PCIe x4 Gen4) 1 x microSD Card Slot |
|
| MISC. Function | 1 x Power / Recovery / Reset Button | |
| Power Input/Connector | DC-IN 9 to 36 VDC / 4-Pin DC Jack Power Connector | |
| Power Consumption | Idle: 5.5 W Full Loading: 51.08* W |
Idle: 5.9 W Full Loading: 71* W |
| *For more test condition information, please refer to user manual | ||
| Dimension (WxDxH) | 270 x 195 x 80 mm (10.63 x 7.67 x 3.15") | |
| Mounting | Wall Mount (optional) / Din Rail (optional) | |
| Net Weight | 4.2 kg (9.7 lb) | |
| Vibration | 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis | |
| Shock | 10 G, IEC 60068-2-27, half sine, 11 ms duration | |
| Temperature | Operating Temperature: -25°C ~ +55°C (-13°F ~ +131°F) with 0.5 m/s air flow Storage Temperature: -40°C ~ +85°C (-40°F ~ +185°F) |
|
| Humidity | 95% @ 40°C (104°F) (non-condensing) | |
| Software Support | Linux (Support Jetpack 5.0 above) | |
| Certification | CE / FCC Class A / UKCA | |
Downloads
Entrega Normal | 5 a 7 dias úteis
Entrega Urgente | 3 a 5 dias úteis
*salvo rutura de stock
Trabalhamos intensamente cumprir os prazos de entrega anunciados. No entanto, enfrentamos uma escassez global relativamente a alguns componentes e fabricantes.
Em caso de dúvidas ou preocupações, entre em contacto connosco para garantir o tempo de entrega.
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