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953.25€

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775.00€
Sku: MX1-10FEP-C246
Tipo de Produto: PCs Industriais
Fabricante: MiTAC

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MX1-10FEP-C246

Sistema embedded fanless com processador Intel® Coffee Lake Xeon / Core-i

MiTAC's MX1-10FEP embedded system is the next generation embedded system with Intel® Coffee Lake C246 workstation chipset which can support Xeon and Core-i LGA1151 socket type processor. The excellent performance, powerful processor, OCP/OVP power protection, and expandable design provide the solution for every complicated task and most types of application.

The MX1-10FEP's 7.8 liter fan-less chassis design and Xpandable module design give it the possibility to implement the complicated tasks and for every workspace and environment. VESA mount holes allow for space-saving and rear-mounting on VESA arms. Flexibilities also mean a rich array of I/O ports (including 2 x Ethernet RJ45, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, PCIe X16 slot, 3-pin Terminal Block Power Input, and 3 x Expansion doors) to add a variety of peripherals. Storage expandability is supported for 3 x high-density hard drives in 2.5" HDD bracket design. Two mPCIe (shared with mSATA) slots provide the support of SSD and wireless interfaces which allow effortless connection to Wi-Fi and Bluetooth networks, and 4Gconnectivity. DIO/COM/LAN/PoE/Power Ignitoin expansion modules extend the capability and possibility to be used in more applications.

O MX1-D é também uma solução NVIDIA GPUCloud (NGC) para os clientes implementarem aplicativos de Inteligência Artificial. O MX1-D passou por testes adicionais para segurança e controlo de sistema remotos, que são requisitos fundamentais para implantações deste tipo. MX1-D é um sistema ideal para executar o DGX™, proporcionando facilidade de implantação.

Caraterísticas

Xeon

  • Up to 1.36X Performance Improvement compared to the previous generation
  • Fanless design with up to Xeon TDP 80W
Xeon

Core i

  • Up to 1.15X Performance Improvement compared to 7th generation
Core-i

Memória ECC DDR4

Memória ECC DDR4

Versáteis Módulos de Expansão

The versatile Xpansion Module design, offers various I/O functionalities through its lower clever cost effective modulation, providing all functions within one system.

  • Versatile I/O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO
  • Power ignition Xpansion module for vehicle application
Módulos de Expansão

Edge AI Accelerator

4X Intel® Movidius™ Myriad™ X for Edge AI

MX1-10FEP-D with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.

Edge AI Accelerator
Edge AI Accelerator

Supports High Resolution Triple Display

Supports triple independent displays (DP + HDMI + DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.

  • Display Port 1.2 (4K@60Hz)
  • HDMI 1.4 (4K@30Hz)
  • DVI-I (FHD@60Hz)
High Resolution Triple Display

-40~70º C Wide Temperature

MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from -40 oC to 70 oC.

Wide Temperature

Certificate

MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.

Certificate

MX1-10FEP I/O

MX1-10FEP_I/O

Dimensões

MX1-10FEP-dimension
Especificações

MX1-10FEP (MX1-10FEP)

Model Chipset Thermal Power AC Adaptor
MX1-10FEP-C246 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity None
MX1-10FEP-C246-AC300 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity 300W AC to DC Adaptor
MX1-10FEP-C246-AC220 C246 Fanless 9~48V Wide Rage DC Input w/ Terminal Block Connectivity 220W AC to DC Adaptor
MX1-10FEP (MX1-10FEP) Specifications
SYSTEM   CPU 9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W / *Please see the CPU Options in Docs / Manuals
  CHIPSET Intel® C246
  SYSTEM MEMORY Max. 32GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM
  GRAPHICS Intel® HD Graphics
  DISPLAY INTERFACE DisplayPort 1.2 / DVI-I / HDMI 1.4
  STORAGE SLOT 3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD
  ETHERNET Intel® I219-LM Giga LAN + I210-IT Giga LAN
  AUDIO Realtek® ALC662
  I/O CHIPSET Nuvoton NCT6116D
  TPM Nuvoton NPCT750AAAYX TPM2.0
  EXPANSION SLOT Storage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage/LTE/Wireless: 2 x mPCIe Full / Half size (USB / PCIe / SATA), w/ SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB)
  INTERNAL SPEAKER 1 x Buzzer
  INDICATOR DIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED
  FRONT I/O 1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w/ Cover / 1 x 2.5" SATAIII HDD / SSD Bay
  REAR I/O 1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) / 1 x Mic-in / 1 x Line-out / 1 x PS/2 / 1 x PCIe x16 slot / 1 x 2-pin Terminal Block Remote Power Reset / 1 x 3-pin Terminal Block Power Input / 1 x 4-pin Terminal Block External Fan Connector / 1 x 2-pin Terminal Block Remote Power on / off / 4 x SMA Antenna (Optional for WiFi/LTE function)
  EDGE AI ENGINE (Optional) 1X/2X/3X/4X Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional)
POWER REQUIREMENT   POWER INPUT 9~48V Wide Range DC Input w/ Terminal Block Connectivity
  POWER ADAPTER Optional
ENVIRONMENTAL   OPERATING TEMPERATURE 35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage
  STORAGE TEMPERATURE -40 ~ 85°C (-40 ~185°F)
  OPERATING HUMIDITY 10% ~ 90% R/H (Non-condensing)
  STORAGE HUMIDITY 10% ~ 95% @85°C non-condensing
  VIBRATION RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64)
  SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
  CERTIFICATION CE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155 / LVD CoC: EN62368-1
MECHANICAL   THERMAL DESIGN Fanless
  MOUNTING Wallmount
  DIMENSIONS (W X D X H) 10.6” x 9.7” x 4.3” (268 x 246 x 108 mm)
  WEIGHT 6.9kg (15.2 lb)
OS   OS SUPPORT Windows® 10 64-bit / Linux (support by request)
PACKING LIST   PACKAGE 1 x Driver CD / 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets (2PCS in 1 set) / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Y Cable (3rd SSD/HDD needs optional SATA Y cable)
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