AIB-MX12
NVIDIA® AGX Orin™ 32GB Module
- Compatible with the NVIDIA Jetson AGX Orin™ 32GB module
- Up to 200 TOPS of performance
- Wide input voltage range from 9 to 36 VCC
- 1x M.2 B-Key/ 1x E-Key/ 1x slot M-Key
- 1x LAN GbE/ 1x 10 GbE/ 4x IEEE 802.3af GbE PSE
- Operating temperature: -25°C ~ +80°C
● 8 x AI performance enables low-latency AI inference
The NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than the NVIDIA® Jetson AGX Xavier™ 32GB module. Built with up to 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, the NVIDIA Jetson AGX Orin module enables server-class AI inference at the Edge with low latency.
● Comprehensive M.2 expansion and LAN ports
AIB-MX11/12/21/22 is a highly expandable platform featuring 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. For network connectivity, the 2 or 4x onboard PSE ports support 2 or 4x POE cameras, while the 1x10GbE port provides data speeds of up to 10 billion bits per second, 10 times faster than the traditional GbE standard.
● Wide input power and operating temperature ranges for various embedded applications
To meet the requirements of various embedded applications, especially in challenging smart factory, smart city and smart transportation environments, AIB-MX11/12/21/22 supports an operating temperature range of -25°C to 80°C and a wide input power range of 9 to 36VDC.
Specifications
| Model Number | AIB-MX11 | AIB-MX12 | AIB-MX21 | AIB-MX22 |
| Module Compatibility | NVIDIA Jetson AGX Orin 32GB | NVIDIA Jetson AGX Orin 64GB | ||
| AI Performance | 200 TOPS | 275 TOPS | ||
| GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores | 2048-core NVIDIA Ampere GPU with 64 Tensor Cores | ||
| CPU | 8-core Arm® Cortex® -A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 | 12-core Arm® Cortex® -A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3 | ||
| Memory | 32GB 256-bit LPDDR5 204.8 GB/s | 64GB 256-bit LPDDR5 204.8 GB/s | ||
| Storage | 64GB eMMC 5.1 | |||
| Display | 1 x HDMI 2.0 Type A | |||
| TPM | TPM v2.0 (optional) | |||
| RTC | With supercapacitor; battery (optional) | |||
| Audio | Line-out/Line-in/Mic (optional with daughterboard) | |||
| Camera Input | 1 x 16-Lane MIPI Expansion Connector (120-Pin) | |||
| LAN | 1 x RJ-45 GbE port, 1 x RJ-45 10GbE port | |||
| PoE Interface | 2 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* | 4 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* | 2 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* | 4 x RJ-45 GbE PSE (IEEE 802.3af compliant, Power Output 15W/Port)* |
| *PSE Port 1 & Port 2 are IEEE 802.3at compliant; total PSE ports support up to 60W | ||||
| USB | 2 x USB 3.2 Gen1 Type A, 1 x OTG Type-C, 1 x USB 3.2 Gen2 Type-C | |||
| I/O Interfaces | 2 x UART, 1 x UART (Debug only), 1 x RS-232, 1 x RS-422/485 (2-in1), 2 x CAN 2.0b (isolation; supports CAN FD), 2 x I2C, 1 x I2S, 1 x SPI, 5 x GPIO, 2 x 3.3VDC/0.5A, 3 x 5VDC/0.5A, 1 x 12VDC/0.5A, 1 x USB 2.0, 1 x microSIM Card Slot | |||
| Expansion | 1 x M.2 B-Key 3042/3052 (LTE/4G/5G) 1 x M.2 E-Key 2230 (WiFi/BT) 1 x M.2 M-Key 2280 (supports NVMe; PCIe x2 Gen3), 1 x microSD Card Slot | |||
| Miscellaneous Functions | 1 x Power / Recovery / Reset button | |||
| Power Consumption | Idle: 10.5 W Full Load: 111* W | Idle: 12 W Full Load: 132* W | ||
| *For more information about the test conditions, please refer to the user manual | ||||
| Power Input/Connector | DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector | |||
| Dimensions (WxDxH) | 176 x 132 x 57.32 mm (6.93 x 5.19 x 2.26 in) | |||
| Net Weight | 0.980 kg (2.161 lb) with Fansink | |||
| Vibration | 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis | |||
| Shock | 10 G, IEC 60068-2-27, half sine, 11 ms duration | |||
| Temperature | Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F) Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F) | |||
| Humidity | 95% @ 40°C (104°F) (non-condensing) | |||
| Software Support | Linux (supports Jetpack 5.0 and later) | |||
| Certification | CE / FCC Class A / UKCA | |||
Dimensions
