Jetway HBJC153I23-Q670B (Intel 12/ 13 LGA1700, 8* LAN 2.5GbE, RAID)
HBJC153I23-Q670B
Rackmount PC HBJC153I23-Q670B for 12th-generation Intel® Core™ CPUs, LGA1700 socket, 8 LAN 2.5GbE ports
- Intel® LGA1700 supports 12th-generation Core processors
- Chipset Intel® Alder Lake Q670E
- 2* DDR5 SO-DIMM sockets at 4800MHz, up to 64GB
- Support for 2* 2.5" SATA HDD devices in RAID 0, 1
- 1* M.2 (key M, 2242/2280), 1* M.2 (key M, 2280), 1* M.2 (key E), 1* M.2 (key B), 1* PCIex4
- 8* 2.5GbE, 2* USB3.2 (Gen.2), 2* USB3.2 (Gen.1), 2* COM, 1* HDMI
- ATX power input with 24-pin ATX connector + 4-pin 12V connector
- TPM2.0 support (optional)
Diagram


Dimensions

Model | – HBJC153I23-Q670B (Default) | ||
MB Model | – MI23-Q6700 (Q670E) | ||
CPU/Chipset | – Intel® 12th/13th-generation LGA1700 socket Core i7/i5/i3/Pentium/Celeron processor (Max. 65W TDP under 180A) | ||
BIOS | – AMI Flash ROM | ||
Memory | – 2* DDR5 4800MHz SO-DIMM up to 64GB | ||
Network | – 7* Intel® i225-V 2.5GbE | ||
Graphics | – Intel® UHD Graphics, shared memory | ||
Storage | – 1* M.2 M-key (2242/2280, PCIe Gen.4×4 with SATA interface) | ||
Expansion | – 1* M.2 E-key (2230, USB2.0/PCIe x1) supports CNVi | ||
Rear Panel I/O | – AC input CON | ||
Front Panel I/O | – 8* RJ45 | ||
Internal Connector | – SIM Card Holder | ||
Power Source | – Power: 1U FLEX 400W POWER | ||
Compliance | – CE, FCC, LVD, RoHS, ErP Ready | ||
Dimensions | – System: 430 (W) x 252 (D) x 44(H) mm | ||
Temperature | – Operating Temperature: 0 ~ 50° C | ||
OS Support | – Windows 11, Linux | ||
Warranty | – 2 Year limited warranty | ||
* Specifications are subject to change without notice. We are not responsible for typographical errors. HDD and OS are not included.