- Intel® 8th-Gen Core™ i hexa-core 35W/ 65W LGA1151 CPU
- Low-profile chassis with hot-swappable 2.5" HDD/ SSD tray
- MezIO™ interface for easy function expansion
- Rugged, fanless operation from -25°C to 70°C
- Up to 6x GigE ports, supporting 9.5 KB jumbo frames
- M.2 2280 M key socket (Gen3 x4), supporting NVMe SSD or Intel® Optane™ memory
- 4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
- VGA/DVI/DP triple independent display output, supporting 4K2K resolution
Introducing Neousys Technology's flagship rugged fanless embedded computers for 2018, the new Nuvo-7000LP series is powered by Intel® 8th-Gen Core™ i processors with an architecture of up to 6-core/ 12-thread, offering a significant performance improvement over previous 6th or 7th-Gen platforms.
The Nuvo-7000LP series is derived from the Nuvo-7000 series and offers the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to its effective fanless design, proprietary MezIO™ interface and extensive range of on-board I/O interfaces, the Nuvo-7000LP series features one front-accessible, hot-swappable HDD/ SSD tray that can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for disk read/ write speeds of over 2000MB/s, or supports the installation of Intel® Optane™ memory for maximum system acceleration.
The Neousys Nuvo-7000LP series combines the latest Intel hexa-core CPU, high-speed I/O interfaces, ultra-fast disk access and flexible storage configuration in a high-performance rugged embedded computer. In addition, the built-in MezIO™ interface supports add-on modules for application-specific I/Os.
Product Highlights
8th-Gen Core i CPU
Powered by an Intel® Coffee Lake Core™ processor and the advanced Intel® Q370 chipset, the Nuvo-7000 series fanless embedded computer delivers outstanding performance for emerging high-end requirements, surpassing the 6th & 7th generations.
Wide Temperature Range
The Nuvo-7000 series fanless embedded computer features a patented passive-cooling thermal design that effectively channels heat away from the heat sink and enables reliable operation across a wide temperature range from -25℃ to 70℃ under 100% CPU load.
Specifications
| System Core | |
|---|---|
| Processor | Supports Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP) - Intel® Core™ i7-8700/ i7-8700T - Intel® Core™ i5-8500/ i5-8500T - Intel® Core™ i3-8100/ i3-8100T - Intel® Pentium® G5400/ G5400T - Intel® Celeron® G4900/ G4900T |
| Chipset | Intel® Q370 Platform Controller Hub |
| Graphics | Integrated Intel® UHD Graphics 630 |
| Memory | Up to 32 GB DDR4 2666/2400 SDRAM (two SODIMM slots) |
| AMT | Supports AMT 12.0 |
| TPM | Supports TPM 2.0 |
| I/O Interface | |
|---|---|
| Ethernet Port | 2x Gigabit Ethernet ports via I219 and I210 (Nuvo-7002LP) 6x Gigabit Ethernet ports via I219 and 5x I210 (Nuvo-7006LP) |
| POE+ | Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget |
| USB | 4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
| Video Port | 1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution |
| Serial Port | 2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| Internal Expansion Bus | |
|---|---|
| Mini PCI-E | 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA) |
| M.2 | 1x M.2 2242 B key socket with dual front-accessible SIM sockets |
| Expandable I/O | 1x MezIO™ expansion port for Neousys MezIO™ modules |
| Storage Interface | |
|---|---|
| SATA HDD | 1x front-accessible, hot-swappable 2.5" HDD/SSD tray 1x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1 |
| M.2 | 1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation |
| mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
| Power Supply | |
|---|---|
| DC Input | 1x 3-pin pluggable terminal block for 8~35VDC DC input |
| Remote Control & Status Output | 1x 3-pin pluggable terminal block for remote control and PWR LED output |
| Mechanical | |
|---|---|
| Dimensions | 240 mm (W) x 225 mm (D) x 79 mm (H) |
| Weight | 3.1 kg |
| Mounting | Wall-mounting (standard) or DIN-Rail mounting (optional) |
| Environmental | |
|---|---|
| Operating Temperature |
with 35W CPU -25°C ~ 70°C ** with 65W CPU -25°C ~ 70°C */** (configured as 35W TDP) -25°C ~ 50°C */** (configured as 65W TDP) |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 10% ~ 90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
Nuvo-7002LP
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 2x GbE ports, MezIO™ interface and low-profile chassis
Nuvo-7006LP
Intel® 8th-Gen Coffee Lake Core™ i7/i5/i3 fanless embedded computer with 6x GbE ports, MezIO™ interface and low-profile chassis
Supported MezIO™ Modules
The Neousys MezIO™ module provides computer signals, power rails and control signals through a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.